一、半導體設備的基本原理和工作方式

半(ban)(ban)導體設備(bei)工作原(yuan)理基于能帶理論(lun)，即(ji)在(zai)半(ban)(ban)導體中(zhong)存在(zai)價(jia)帶和導帶，其中(zhong)價(jia)帶是半(ban)(ban)導體材料中(zhong)的原(yuan)子，而導帶中(zhong)的原(yuan)子在(zai)半(ban)(ban)導體中(zhong)被加熱或激發(fa)后(hou)被激發(fa)到價(jia)帶之外。當外部電(dian)荷作用于半(ban)(ban)導體中(zhong)時(shi)，它可以改變電(dian)子在(zai)能帶中(zhong)的分布，導致電(dian)導率的變化(hua)。

半導體設備具有重要的電子功(gong)能，如場效(xiao)應管、整流器(qi)、功(gong)率放大器(qi)和發(fa)光(guang)二極管。基于不同(tong)應用需要，半導體設(she)備可以通過材(cai)料、結構(gou)、工藝等方面做(zuo)出不同(tong)的改進(jin)和針對性設(she)計。

二、半導體設備核心部件是什么

據(ju)統(tong)(tong)(tong)(tong)(tong)計(ji)，半導體(ti)設(she)備的(de)關鍵(jian)子系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)主要分為 8 大類。包含：氣(qi)液流量(liang)控 制系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)、真空系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)、制程診斷系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)、光學(xue)系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)、電源及氣(qi)體(ti)反應系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)、熱管理系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)、晶圓傳(chuan)送系(xi)(xi) 統(tong)(tong)(tong)(tong)(tong)、其他集成系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)及關鍵(jian)組件(jian)，每個子系(xi)(xi)統(tong)(tong)(tong)(tong)(tong)亦由數量(liang)龐大的(de)零部件(jian)組合而成。

不同(tong)半導體(ti)設備的核(he)心(xin)零(ling)部件(jian)有所不同(tong)。例(li)如：光刻(ke)機的核(he)心(xin)零(ling)部件(jian)包括工作(zuo)臺、投影物鏡(jing)、光源 等，而等離子體(ti)真空設備（PVD、CVD、刻(ke)蝕）的核(he)心(xin)零(ling)部件(jian)包括 MFC、射頻電源、真空泵、ESC 等。