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杭州立昂微(wei)電(dian)(dian)子股(gu)份有(you)限(xian)公司2002年3月(yue)在杭州經濟技術(shu)開發區注冊成立，是專注于集成電(dian)(dian)路(lu)用半導體材料、半導體功率(lv)芯片(pian)(pian)、集成電(dian)(dian)路(lu)芯片(pian)(pian)設計、開發、制造、銷售的高新技術(shu)企業(ye)。

公(gong)(gong)(gong)司(si)(si)(si)于2020年9月11日在(zai)上海(hai)(hai)證(zheng)(zheng)券交易所主板(ban)A股(gu)(gu)掛牌上市（證(zheng)(zheng)券簡稱：立(li)(li)昂(ang)(ang)微(wei)(wei)，證(zheng)(zheng)券代(dai)碼(ma)：605358），目前注(zhu)冊資本為67684.8359萬元，擁有(you)(you)(you)杭(hang)州(zhou)、寧波、衢州(zhou)、嘉興、海(hai)(hai)寧五大經(jing)營基地，下(xia)轄杭(hang)州(zhou)立(li)(li)昂(ang)(ang)東芯微(wei)(wei)電子有(you)(you)(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)(si)、海(hai)(hai)寧立(li)(li)昂(ang)(ang)東芯微(wei)(wei)電子有(you)(you)(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)(si)、浙(zhe)江金(jin)(jin)瑞(rui)泓(hong)科(ke)(ke)技股(gu)(gu)份有(you)(you)(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)(si)、金(jin)(jin)瑞(rui)泓(hong)科(ke)(ke)技（衢州(zhou)）有(you)(you)(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)(si)、金(jin)(jin)瑞(rui)泓(hong)微(wei)(wei)電子（衢州(zhou)）有(you)(you)(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)(si)、金(jin)(jin)瑞(rui)泓(hong)微(wei)(wei)電子（嘉興）有(you)(you)(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)(si)、杭(hang)州(zhou)立(li)(li)昂(ang)(ang)半導(dao)體(ti)技術有(you)(you)(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)(si)、衢州(zhou)金(jin)(jin)瑞(rui)泓(hong)半導(dao)體(ti)科(ke)(ke)技有(you)(you)(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)(si)八家(jia)子公(gong)(gong)(gong)司(si)(si)(si)。公(gong)(gong)(gong)司(si)(si)(si)建有(you)(you)(you)“浙(zhe)江省立(li)(li)昂(ang)(ang)微(wei)(wei)波射頻集(ji)成電路企(qi)(qi)業研究(jiu)院”、金(jin)(jin)瑞(rui)泓(hong)院士工作(zuo)站、金(jin)(jin)瑞(rui)泓(hong)博士后企(qi)(qi)業工作(zuo)站。

歷(li)經(jing)近二十年的(de)建設與發展，立(li)昂微(wei)已經(jing)擁有一個競爭力較(jiao)強的(de)具(ju)備硅(gui)單(dan)晶、硅(gui)研(yan)磨片(pian)(pian)、硅(gui)拋光片(pian)(pian)、硅(gui)外延(yan)片(pian)(pian)、分立(li)器件與集成電(dian)路芯(xin)片(pian)(pian)制(zhi)造能力的(de)完(wan)整產業平臺，橫跨半導體硅(gui)材料、半導體分立(li)器件和集成電(dian)路芯(xin)片(pian)(pian)三大細分行(xing)業。