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杭州立昂微電(dian)子股(gu)份有(you)限(xian)公(gong)司2002年3月(yue)在杭州經濟技術(shu)開(kai)發區注(zhu)冊成立，是專注(zhu)于集成電(dian)路用半導體(ti)材(cai)料、半導體(ti)功(gong)率(lv)芯(xin)片、集成電(dian)路芯(xin)片設計、開(kai)發、制造(zao)、銷(xiao)售的高新技術(shu)企業。

公(gong)(gong)(gong)司(si)(si)于2020年9月11日在上海證(zheng)券交易所主板A股掛牌上市(shi)（證(zheng)券簡稱(cheng)：立(li)昂微(wei)(wei)，證(zheng)券代碼：605358），目前注冊資本為67684.8359萬元，擁(yong)有(you)杭州(zhou)、寧波、衢州(zhou)、嘉(jia)興、海寧五(wu)大經營基地(di)，下轄(xia)杭州(zhou)立(li)昂東芯微(wei)(wei)電(dian)(dian)子有(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)、海寧立(li)昂東芯微(wei)(wei)電(dian)(dian)子有(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)、浙江(jiang)(jiang)金(jin)(jin)瑞(rui)(rui)泓科技(ji)股份有(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)、金(jin)(jin)瑞(rui)(rui)泓科技(ji)（衢州(zhou)）有(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)、金(jin)(jin)瑞(rui)(rui)泓微(wei)(wei)電(dian)(dian)子（衢州(zhou)）有(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)、金(jin)(jin)瑞(rui)(rui)泓微(wei)(wei)電(dian)(dian)子（嘉(jia)興）有(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)、杭州(zhou)立(li)昂半導(dao)體(ti)(ti)技(ji)術(shu)有(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)、衢州(zhou)金(jin)(jin)瑞(rui)(rui)泓半導(dao)體(ti)(ti)科技(ji)有(you)限(xian)(xian)公(gong)(gong)(gong)司(si)(si)八家子公(gong)(gong)(gong)司(si)(si)。公(gong)(gong)(gong)司(si)(si)建有(you)“浙江(jiang)(jiang)省立(li)昂微(wei)(wei)波射頻(pin)集成(cheng)電(dian)(dian)路企(qi)業(ye)(ye)研究(jiu)院”、金(jin)(jin)瑞(rui)(rui)泓院士工作站、金(jin)(jin)瑞(rui)(rui)泓博(bo)士后(hou)企(qi)業(ye)(ye)工作站。

歷經近二十年的建設(she)與發展，立(li)(li)昂微已經擁(yong)有一個(ge)競爭力較強的具(ju)備(bei)硅(gui)單晶、硅(gui)研(yan)磨(mo)片、硅(gui)拋光片、硅(gui)外延片、分(fen)立(li)(li)器件與集(ji)成電(dian)路芯片制造(zao)能力的完整產(chan)業平臺，橫跨(kua)半(ban)導體硅(gui)材料、半(ban)導體分(fen)立(li)(li)器件和集(ji)成電(dian)路芯片三大細分(fen)行業。