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贛州逸豪新(xin)(xin)材料(liao)股份有限公司(si)(si)（下文(wen)簡稱(cheng)“公司(si)(si)”）成立(li)于2003年(nian)，隸屬于贛州逸豪集團(tuan)，系(xi)從事高精電解銅箔及新(xin)(xin)型電子(zi)元器件研發、制造與銷售(shou)的國家(jia)高新(xin)(xin)技術企(qi)業。公司(si)(si)主要產品(pin)為電子(zi)電路銅箔、鋁基(ji)覆(fu)銅板(ban)和線路板(ban)。

電(dian)(dian)子(zi)(zi)(zi)(zi)電(dian)(dian)路銅(tong)箔(bo)(bo)系以銅(tong)為(wei)主(zhu)(zhu)要(yao)原料，采用電(dian)(dian)解法生(sheng)(sheng)產(chan)的(de)(de)金屬銅(tong)箔(bo)(bo)，主(zhu)(zhu)要(yao)作為(wei)覆(fu)銅(tong)板、印(yin)制電(dian)(dian)路板中(zhong)用于連(lian)接各(ge)個(ge)電(dian)(dian)子(zi)(zi)(zi)(zi)元器(qi)件的(de)(de)導電(dian)(dian)體(ti)，是覆(fu)銅(tong)板、印(yin)制電(dian)(dian)路板生(sheng)(sheng)產(chan)的(de)(de)主(zhu)(zhu)要(yao)材(cai)料之(zhi)一。公司PCB銅(tong)箔(bo)(bo)業(ye)務的(de)(de)客(ke)(ke)戶(hu)主(zhu)(zhu)要(yao)為(wei)覆(fu)銅(tong)板、PCB等(deng)(deng)下游行(xing)業(ye)的(de)(de)知名企業(ye)，其中(zhong)PCB行(xing)業(ye)客(ke)(ke)戶(hu)占比相對(dui)較高。PCB客(ke)(ke)戶(hu)的(de)(de)銅(tong)箔(bo)(bo)訂(ding)單具(ju)有“多規格、多批(pi)次、短交期”的(de)(de)特(te)點，公司基于多年來對(dui)PCB生(sheng)(sheng)產(chan)工藝的(de)(de)了(le)解，建立(li)了(le)高度柔性(xing)(xing)化的(de)(de)生(sheng)(sheng)產(chan)管理體(ti)系，能更(geng)好地滿足PCB客(ke)(ke)戶(hu)在幅寬(kuan)、厚(hou)度和性(xing)(xing)能等(deng)(deng)方面的(de)(de)多樣化需求。公司銅(tong)箔(bo)(bo)產(chan)品的(de)(de)種類豐富，涵蓋超薄(bo)銅(tong)箔(bo)(bo)、薄(bo)銅(tong)箔(bo)(bo)、常規銅(tong)箔(bo)(bo)和厚(hou)銅(tong)箔(bo)(bo)等(deng)(deng)，最(zui)終應用于通訊電(dian)(dian)子(zi)(zi)(zi)(zi)、計算機、消(xiao)費電(dian)(dian)子(zi)(zi)(zi)(zi)、汽車電(dian)(dian)子(zi)(zi)(zi)(zi)等(deng)(deng)眾多領域。

同(tong)時(shi)，公(gong)司將自產(chan)(chan)銅箔作為主要原材(cai)料之一延伸(shen)生產(chan)(chan)鋁(lv)基覆銅板(ban)(ban)。鋁(lv)基覆銅板(ban)(ban)屬于剛性(xing)覆銅板(ban)(ban)的一種，由導(dao)電(dian)層(ceng)、絕緣(yuan)層(ceng)、金(jin)屬基層(ceng)組成(cheng)，其(qi)中(zhong)導(dao)電(dian)層(ceng)經過蝕刻可形成(cheng)印(yin)制電(dian)路，絕緣(yuan)層(ceng)主要起粘接、絕緣(yuan)和導(dao)熱(re)的功能(neng)，金(jin)屬層(ceng)主要用于滿足(zu)鋁(lv)基覆銅板(ban)(ban)的散熱(re)、機械性(xing)能(neng)、電(dian)性(xing)能(neng)等需求(qiu)。

公(gong)(gong)司掌(zhang)握了鋁(lv)基覆(fu)銅(tong)(tong)板(ban)全(quan)制(zhi)程(cheng)生(sheng)產(chan)(chan)技術，公(gong)(gong)司鋁(lv)基覆(fu)銅(tong)(tong)板(ban)產(chan)(chan)品(pin)(pin)使用(yong)自產(chan)(chan)PCB銅(tong)(tong)箔(bo)，具有技術先(xian)進、規格齊全(quan)、品(pin)(pin)質穩定、交期及時、低成本等(deng)優勢。公(gong)(gong)司鋁(lv)基覆(fu)銅(tong)(tong)板(ban)主要應用(yong)于LED下(xia)游應用(yong)行業(ye)(ye)，如LED（含miniLED）背光、LED照明(ming)等(deng)。公(gong)(gong)司PCB項(xiang)(xiang)目一(yi)(yi)期預計于2021年下(xia)半年投產(chan)(chan)，該項(xiang)(xiang)目將(jiang)建設成國(guo)內一(yi)(yi)流(liu)的(de)(de)生(sheng)產(chan)(chan)工藝流(liu)程(cheng)自動(dong)化(hua)、智(zhi)能(neng)(neng)(neng)化(hua)程(cheng)度高(gao)、產(chan)(chan)品(pin)(pin)良率高(gao)且交付周期短的(de)(de)新型智(zhi)能(neng)(neng)(neng)制(zhi)造(zao)工廠，結合公(gong)(gong)司的(de)(de)銅(tong)(tong)箔(bo)與板(ban)材(cai)生(sheng)產(chan)(chan)項(xiang)(xiang)目，形成一(yi)(yi)個PCB制(zhi)造(zao)產(chan)(chan)業(ye)(ye)鏈，為(wei)客戶從銅(tong)(tong)箔(bo)、板(ban)材(cai)到PCB制(zhi)造(zao)提供(gong)一(yi)(yi)站式的(de)(de)服務，滿(man)足電(dian)(dian)子電(dian)(dian)路(lu)行業(ye)(ye)中的(de)(de)客戶運營和(he)發展需要。產(chan)(chan)品(pin)(pin)定位商用(yong)5G、智(zhi)能(neng)(neng)(neng)家電(dian)(dian)、智(zhi)能(neng)(neng)(neng)制(zhi)造(zao)、新能(neng)(neng)(neng)源汽車(che)、手機板(ban)、LED照明(ming)等(deng)產(chan)(chan)品(pin)(pin)配套集成模塊為(wei)未來(lai)主攻發展方(fang)向。