圣邦微(wei)電子(北京)股份有限公司(si)(股票(piao)代碼(ma)300661)專注(zhu)于高性(xing)能(neng)、高品質模(mo)擬集成電路的研發和銷售(shou)。
公司產(chan)品(pin)覆蓋信號(hao)鏈和電(dian)(dian)(dian)(dian)(dian)源管(guan)理兩(liang)大(da)領域,擁有(you)(you)25大(da)類(lei)3500余款可銷(xiao)售型號(hao),包括各(ge)類(lei)運(yun)算放(fang)大(da)器(qi)(qi)(qi)(qi)及比(bi)較(jiao)器(qi)(qi)(qi)(qi)、音(yin)頻功率放(fang)大(da)器(qi)(qi)(qi)(qi)、視頻緩沖器(qi)(qi)(qi)(qi)、線(xian)路(lu)驅(qu)動器(qi)(qi)(qi)(qi)、模擬開(kai)關(guan)、溫度傳感器(qi)(qi)(qi)(qi)、模數轉(zhuan)(zhuan)(zhuan)(zhuan)換(huan)(huan)器(qi)(qi)(qi)(qi)(ADC)、數模轉(zhuan)(zhuan)(zhuan)(zhuan)換(huan)(huan)器(qi)(qi)(qi)(qi)(DAC)、電(dian)(dian)(dian)(dian)(dian)平轉(zhuan)(zhuan)(zhuan)(zhuan)換(huan)(huan)芯(xin)(xin)片(pian)、接(jie)口電(dian)(dian)(dian)(dian)(dian)路(lu)、電(dian)(dian)(dian)(dian)(dian)壓(ya)基準芯(xin)(xin)片(pian)、小邏輯芯(xin)(xin)片(pian)、LDO、微處理器(qi)(qi)(qi)(qi)電(dian)(dian)(dian)(dian)(dian)源監(jian)控電(dian)(dian)(dian)(dian)(dian)路(lu)、DC/DC降(jiang)壓(ya)轉(zhuan)(zhuan)(zhuan)(zhuan)換(huan)(huan)器(qi)(qi)(qi)(qi)、DC/DC升(sheng)壓(ya)轉(zhuan)(zhuan)(zhuan)(zhuan)換(huan)(huan)器(qi)(qi)(qi)(qi)、DC/DC升(sheng)降(jiang)壓(ya)轉(zhuan)(zhuan)(zhuan)(zhuan)換(huan)(huan)器(qi)(qi)(qi)(qi)、背光(guang)及閃光(guang)燈LED驅(qu)動器(qi)(qi)(qi)(qi)、AMOLED電(dian)(dian)(dian)(dian)(dian)源芯(xin)(xin)片(pian)、PMU、OVP及負(fu)載(zai)開(kai)關(guan)、電(dian)(dian)(dian)(dian)(dian)池(chi)充放(fang)電(dian)(dian)(dian)(dian)(dian)管(guan)理芯(xin)(xin)片(pian)、電(dian)(dian)(dian)(dian)(dian)池(chi)保護芯(xin)(xin)片(pian)、馬達驅(qu)動芯(xin)(xin)片(pian)、MOSFET驅(qu)動芯(xin)(xin)片(pian)等。產(chan)品(pin)性能和品(pin)質(zhi)對標世界優秀(xiu)模擬芯(xin)(xin)片(pian)廠商同類(lei)產(chan)品(pin),部分關(guan)鍵性能指標有(you)(you)所超越,廣泛應(ying)用于(yu)通訊設備、消費類(lei)電(dian)(dian)(dian)(dian)(dian)子、工(gong)業控制、醫療儀器(qi)(qi)(qi)(qi)和汽車(che)電(dian)(dian)(dian)(dian)(dian)子等領域,以及物聯網、新能源和人(ren)工(gong)智能等新興市場(chang)。
公司技(ji)術(shu)團隊由(you)國際行業(ye)專家組(zu)成,擁有(you)先進的模(mo)擬集成電路設計(ji)、工(gong)藝(yi)、測試技(ji)術(shu)和豐富的生產(chan)(chan)管(guan)(guan)理(li)、品質(zhi)管(guan)(guan)理(li)經驗,核(he)心人員平均從(cong)業(ye)年齡超過二十(shi)年。公司全部產(chan)(chan)品自(zi)主研發,擁有(you)百(bai)分之百(bai)自(zi)主知識產(chan)(chan)權。
展望(wang)未(wei)來,公司(si)將繼續厚積薄發,推陳出新致力成為世界模擬芯片(pian)行業的領(ling)跑(pao)者。
標準號 | 標準名稱 | 發布日期 | 實施日期 | 標準詳情 |
GB/T 35010.3-2018 | 半導體芯片產品 第3部分:操作、包裝和貯存指南 | 2019-03-15 | 2019-08-01 | |
GB/T 4377-2018 | 半導體集成電路 電壓調整器測試方法 | 2019-03-15 | 2019-08-01 |