西安(an)(an)(an)(an)紫(zi)(zi)光(guang)(guang)(guang)(guang)國(guo)(guo)(guo)芯(xin)半(ban)導(dao)體股份有限(xian)(xian)公(gong)司(si)前(qian)身為成立(li)于2004年(nian)(nian)德國(guo)(guo)(guo)英飛凌西安(an)(an)(an)(an)研發(fa)中心的存(cun)儲事業部(bu),2006年(nian)(nian)分(fen)拆成為獨立(li)的奇夢達(da)科技西安(an)(an)(an)(an)有限(xian)(xian)公(gong)司(si),2009年(nian)(nian)被浪潮(chao)集(ji)(ji)(ji)團(tuan)收購(gou)轉制成為國(guo)(guo)(guo)內公(gong)司(si)并更名為西安(an)(an)(an)(an)華芯(xin)半(ban)導(dao)體有限(xian)(xian)公(gong)司(si)。2015年(nian)(nian),紫(zi)(zi)光(guang)(guang)(guang)(guang)集(ji)(ji)(ji)團(tuan)紫(zi)(zi)光(guang)(guang)(guang)(guang)國(guo)(guo)(guo)芯(xin)微(wei)電子(zi)股份有限(xian)(xian)公(gong)司(si)收購(gou)西安(an)(an)(an)(an)華芯(xin)半(ban)導(dao)體有限(xian)(xian)公(gong)司(si)并更名為西安(an)(an)(an)(an)紫(zi)(zi)光(guang)(guang)(guang)(guang)國(guo)(guo)(guo)芯(xin)半(ban)導(dao)體有限(xian)(xian)公(gong)司(si)。2019年(nian)(nian)12月,經過重組,西安(an)(an)(an)(an)紫(zi)(zi)光(guang)(guang)(guang)(guang)國(guo)(guo)(guo)芯(xin)半(ban)導(dao)體并入北京紫(zi)(zi)光(guang)(guang)(guang)(guang)存(cun)儲科技有限(xian)(xian)公(gong)司(si)。2022年(nian)(nian)紫(zi)(zi)光(guang)(guang)(guang)(guang)集(ji)(ji)(ji)團(tuan)實(shi)控人(ren)變更為智廣芯(xin)控股,隨著紫(zi)(zi)光(guang)(guang)(guang)(guang)集(ji)(ji)(ji)團(tuan)重整完畢,西安(an)(an)(an)(an)紫(zi)(zi)光(guang)(guang)(guang)(guang)國(guo)(guo)(guo)芯(xin)踏上發(fa)展(zhan)新征(zheng)程。
公(gong)司是(shi)以(yi)(yi)DRAM(動態隨機存(cun)(cun)取存(cun)(cun)儲(chu)器(qi))存(cun)(cun)儲(chu)技(ji)術為核心的產品(pin)和(he)(he)服(fu)務(wu)提供商(shang),核心業務(wu)包(bao)括(kuo)存(cun)(cun)儲(chu)器(qi)設計(ji)開(kai)(kai)發(fa),存(cun)(cun)儲(chu)器(qi)產品(pin)量產銷售,以(yi)(yi)及(ji)專(zhuan)用集成(cheng)電路設計(ji)開(kai)(kai)發(fa)服(fu)務(wu),產品(pin)包(bao)括(kuo)DRAMKGD、DRAM顆粒、DRAM模組、系統產品(pin)和(he)(he)設計(ji)服(fu)務(wu)。目前公(gong)司員工人數超過(guo)600名,其中研(yan)發(fa)工程師占比80%以(yi)(yi)上(shang),70%擁有(you)碩士(shi)或博士(shi)學位。公(gong)司還擁有(you)二十余位外籍(ji)專(zhuan)家和(he)(he)海外留學歸國人員。
公司多年來(lai)一直(zhi)專注于存(cun)儲(chu)器尤其是DRAM存(cun)儲(chu)器的(de)研(yan)(yan)發和(he)技術(shu)(shu)(shu)積累,擁有從(cong)產(chan)(chan)品立項、指標定義、電路設計(ji)、版圖設計(ji)到(dao)硅片(pian)、顆粒、內存(cun)條測試及(ji)(ji)(ji)售前售后技術(shu)(shu)(shu)支持(chi)等(deng)(deng)全方面技術(shu)(shu)(shu)積累。二十(shi)余(yu)款芯(xin)(xin)片(pian)產(chan)(chan)品和(he)四十(shi)余(yu)款模(mo)組產(chan)(chan)品實(shi)現全球量產(chan)(chan)和(he)銷售。產(chan)(chan)品廣泛(fan)應用(yong)于計(ji)算機、服(fu)務器、移動通訊、消費電子及(ji)(ji)(ji)工(gong)(gong)業應用(yong)等(deng)(deng)領(ling)域。在面向大數據和(he)人(ren)工(gong)(gong)智能(neng)等(deng)(deng)新(xin)(xin)興領(ling)域,公司采用(yong)三維集成(cheng)技術(shu)(shu)(shu),實(shi)現將邏輯(ji)晶(jing)圓和(he)DRAM晶(jing)圓的(de)異質集成(cheng),開發出高帶寬、大容量的(de)3DDRAM芯(xin)(xin)片(pian),及(ji)(ji)(ji)內嵌(qian)超高帶寬超低功耗DRAM的(de)人(ren)工(gong)(gong)智能(neng)(AI)芯(xin)(xin)片(pian)。公司還(huan)在NANDFlash、NORFlash和(he)新(xin)(xin)型存(cun)儲(chu)器RRAM等(deng)(deng)領(ling)域開發有產(chan)(chan)品,進行(xing)了(le)研(yan)(yan)發布(bu)局。
西安紫光國芯(xin)(xin)同時還(huan)擁有數字電(dian)路和(he)(he)混合電(dian)路設(she)計(ji)(ji)團隊,提(ti)(ti)供基于世界(jie)優秀工(gong)藝(yi)的ASIC設(she)計(ji)(ji)開(kai)發(fa)驗(yan)(yan)證(zheng)服(fu)務。公(gong)(gong)司具備(bei)從(cong)設(she)計(ji)(ji)規格(ge)到芯(xin)(xin)片(pian)(pian)(pian)流(liu)片(pian)(pian)(pian)完(wan)整流(liu)程的設(she)計(ji)(ji)開(kai)發(fa)經驗(yan)(yan),包括:設(she)計(ji)(ji)實(shi)現、功能驗(yan)(yan)證(zheng)、綜合和(he)(he)DFT、物理實(shi)現、時序、物理檢查及流(liu)片(pian)(pian)(pian)。公(gong)(gong)司在過去幾年中成功為客(ke)戶(hu)完(wan)成了十余(yu)款基于65nm/40nm/28nm/14nm/10nm/7nm/5nm,和(he)(he)目(mu)前精良的4nm工(gong)藝(yi)的SoC芯(xin)(xin)片(pian)(pian)(pian)設(she)計(ji)(ji)和(he)(he)流(liu)片(pian)(pian)(pian),幫助客(ke)戶(hu)完(wan)成芯(xin)(xin)片(pian)(pian)(pian)設(she)計(ji)(ji)和(he)(he)測試。公(gong)(gong)司也成功提(ti)(ti)供多款從(cong)產(chan)品定義開(kai)始完(wan)成芯(xin)(xin)片(pian)(pian)(pian)架構(gou)設(she)計(ji)(ji)、電(dian)路設(she)計(ji)(ji)、仿真驗(yan)(yan)證(zheng)、后端設(she)計(ji)(ji)、流(liu)片(pian)(pian)(pian)、測試驗(yan)(yan)證(zheng)、量產(chan)工(gong)程全流(liu)程的“交(jiao)鑰(yao)匙(chi)”芯(xin)(xin)片(pian)(pian)(pian)開(kai)發(fa)服(fu)務。
公(gong)司是“國家高(gao)新技(ji)術企業(ye)”、“國家企業(ye)技(ji)術中(zhong)心(xin)”、“國家知(zhi)識(shi)產(chan)權(quan)優勢(shi)企業(ye)”、“西安市存儲器(qi)工(gong)程技(ji)術研究中(zhong)心(xin)”,公(gong)司建設有占地(di)面積(ji)2000余平米的(de)世界前列水(shui)平的(de)存儲器(qi)芯片測(ce)試(shi)、模組測(ce)試(shi)、模組應(ying)用(yong)(yong)和ASIC測(ce)試(shi)實驗室(shi)4個,大型(xing)成(cheng)套(tao)測(ce)試(shi)設備(bei)30余臺套(tao)。可支持各類(lei)存儲器(qi)和ASIC產(chan)品的(de)功能和性能測(ce)試(shi)驗證分析、量產(chan)測(ce)試(shi)工(gong)程開(kai)發、應(ying)用(yong)(yong)工(gong)程測(ce)試(shi)、以及小批量生產(chan)和工(gong)程樣品開(kai)發。
標準號 | 標準名稱 | 發布日期 | 實施日期 | 標準詳情 |
GB/T 36474-2018 | 半導體集成電路 第三代雙倍數據速率同步動態隨機存儲器 (DDR3 SDRAM)測試方法 | 2019-06-07 | 2020-01-01 |