電路板的材質是什么

印刷電路板的(de)主要材料(liao)是覆(fu)銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)(ban)，而覆(fu)銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)(ban)（敷銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)(ban)）是由基板(ban)(ban)(ban)(ban)、銅(tong)(tong)(tong)(tong)箔和粘(zhan)合(he)劑構成(cheng)的(de)。基板(ban)(ban)(ban)(ban)是由高分子合(he)成(cheng)樹脂和增強(qiang)材料(liao)組(zu)成(cheng)的(de)絕緣層(ceng)板(ban)(ban)(ban)(ban)；在(zai)基板(ban)(ban)(ban)(ban)的(de)表面(mian)覆(fu)蓋著一(yi)層(ceng)導電(dian)率較高、焊接性良好的(de)純銅(tong)(tong)(tong)(tong)箔，常(chang)用厚(hou)度35～50／ma；銅(tong)(tong)(tong)(tong)箔覆(fu)蓋在(zai)基板(ban)(ban)(ban)(ban)一(yi)面(mian)的(de)覆(fu)銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)(ban)稱為單面(mian)覆(fu)銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)(ban)，基板(ban)(ban)(ban)(ban)的(de)兩面(mian)均覆(fu)蓋銅(tong)(tong)(tong)(tong)箔的(de)覆(fu)銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)(ban)稱雙面(mian)覆(fu)銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)(ban)；銅(tong)(tong)(tong)(tong)箔能否牢固地覆(fu)在(zai)基板(ban)(ban)(ban)(ban)上，則由粘(zhan)合(he)劑來(lai)完成(cheng)。常(chang)用覆(fu)銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)(ban)的(de)厚(hou)度有(you)1.0mm、1.5mm和2.0mm三種。

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常用的覆銅板種類有哪些

覆銅板(ban)的種類(lei)也較多。按絕緣材料不(bu)同(tong)可分(fen)為(wei)紙基(ji)板(ban)、玻璃布基(ji)板(ban)和(he)合成纖維板(ban)；按粘結劑樹(shu)脂(zhi)不(bu)同(tong)又分(fen)為(wei)酚醛、環氧、聚脂(zhi)和(he)聚四氟乙烯(xi)等；按用途(tu)可分(fen)為(wei)通用型和(he)特殊型。

（1）覆銅(tong)箔酚醛紙層壓板

是由絕(jue)緣浸(jin)(jin)漬紙(zhi)(zhi)（TFz一62）或棉纖維浸(jin)(jin)漬紙(zhi)(zhi)（1TZ-一63）浸(jin)(jin)以(yi)酚醛樹脂(zhi)經熱壓而(er)成的(de)層(ceng)壓制(zhi)品，兩表面膠紙(zhi)(zhi)可附以(yi)單張(zhang)無堿玻璃(li)浸(jin)(jin)膠布，其(qi)一面敷以(yi)銅箔。主要用作無線電設備中的(de)印制(zhi)電路板。

（2）覆(fu)銅箔酚醛玻璃布層壓板

是用無堿玻璃布浸以環氧酚醛樹脂經熱壓而成的層壓制品，其一面或雙面敷以銅箔，具有質輕、電氣和機械性能良好、加工方便等優點。其板面呈淡黃色，若用三氰二胺作固化劑，則板面呈淡綠色，具有良好的透明度。主要在工作溫度和工作頻率較高的無線電設備中用作印制電路板。

（3）覆銅(tong)箔(bo)聚四氟乙烯層壓板(ban)

是以聚四氟乙烯板(ban)為基(ji)板(ban)，敷以銅箔(bo)經熱壓而(er)成的一(yi)種敷銅板(ban)。主要(yao)用(yong)于高頻和(he)超(chao)高頻線路中作印制板(ban)用(yong)。

（4）覆銅(tong)箔環氧玻璃布層壓板

是孔金屬化印制板常用的(de)材料。

（5）軟性聚(ju)酯敷銅薄膜

是用(yong)(yong)聚酯薄膜與銅(tong)熱壓(ya)而成(cheng)的(de)帶狀(zhuang)(zhuang)材料，在應用(yong)(yong)中將它(ta)卷曲成(cheng)螺旋形(xing)狀(zhuang)(zhuang)放在設備內部。為(wei)了加固或防潮，常以環氧樹脂將它(ta)灌注成(cheng)一(yi)個整體。主要用(yong)(yong)作柔性印制(zhi)電路和(he)印制(zhi)電纜，可作為(wei)接插件的(de)過渡(du)線。目前，市場上供應的(de)覆銅(tong)板，從基材考慮(lv)，主要可分以下幾類(lei)：紙(zhi)基板、玻纖布(bu)(bu)基板、合成(cheng)纖維布(bu)(bu)基板、無(wu)紡布(bu)(bu)基板、復合基板。

覆銅板常用制作材料有哪些

FR-1──酚醛棉紙，這基材通稱電木板（比FR-2較(jiao)高經濟性(xing)）

FR-2──酚醛棉(mian)紙

FR-3──棉紙（Cotton paper）、環氧樹脂

FR-4──玻璃布（Woven glass）、環氧樹脂

FR-5──玻璃布、環氧樹脂(zhi)

FR-6──毛(mao)面玻(bo)璃(li)、聚酯

G-10──玻璃布、環(huan)氧樹脂

CEM-1──棉(mian)紙、環(huan)氧樹(shu)脂（阻燃）

CEM-2──棉紙、環氧樹脂（非阻(zu)燃(ran)）

CEM-3──玻璃布、環氧樹脂

CEM-4──玻璃布(bu)、環氧(yang)樹脂

CEM-5──玻(bo)璃布(bu)、多(duo)元酯

AIN──氮(dan)化鋁(lv)

SIC──碳(tan)化硅