電路板的材質是什么

印刷電路板的(de)(de)(de)主要材料是(shi)覆(fu)(fu)銅(tong)(tong)(tong)(tong)(tong)板(ban)(ban)(ban)，而(er)覆(fu)(fu)銅(tong)(tong)(tong)(tong)(tong)板(ban)(ban)(ban)（敷銅(tong)(tong)(tong)(tong)(tong)板(ban)(ban)(ban)）是(shi)由基板(ban)(ban)(ban)、銅(tong)(tong)(tong)(tong)(tong)箔(bo)(bo)和粘合劑(ji)構成(cheng)(cheng)的(de)(de)(de)。基板(ban)(ban)(ban)是(shi)由高(gao)分子合成(cheng)(cheng)樹(shu)脂和增(zeng)強(qiang)材料組成(cheng)(cheng)的(de)(de)(de)絕緣(yuan)層板(ban)(ban)(ban)；在基板(ban)(ban)(ban)的(de)(de)(de)表(biao)面(mian)(mian)覆(fu)(fu)蓋著一層導(dao)電率較高(gao)、焊接性良好的(de)(de)(de)純銅(tong)(tong)(tong)(tong)(tong)箔(bo)(bo)，常用厚度(du)35～50／ma；銅(tong)(tong)(tong)(tong)(tong)箔(bo)(bo)覆(fu)(fu)蓋在基板(ban)(ban)(ban)一面(mian)(mian)的(de)(de)(de)覆(fu)(fu)銅(tong)(tong)(tong)(tong)(tong)板(ban)(ban)(ban)稱為單面(mian)(mian)覆(fu)(fu)銅(tong)(tong)(tong)(tong)(tong)板(ban)(ban)(ban)，基板(ban)(ban)(ban)的(de)(de)(de)兩面(mian)(mian)均覆(fu)(fu)蓋銅(tong)(tong)(tong)(tong)(tong)箔(bo)(bo)的(de)(de)(de)覆(fu)(fu)銅(tong)(tong)(tong)(tong)(tong)板(ban)(ban)(ban)稱雙面(mian)(mian)覆(fu)(fu)銅(tong)(tong)(tong)(tong)(tong)板(ban)(ban)(ban)；銅(tong)(tong)(tong)(tong)(tong)箔(bo)(bo)能(neng)否(fou)牢(lao)固地覆(fu)(fu)在基板(ban)(ban)(ban)上，則由粘合劑(ji)來完成(cheng)(cheng)。常用覆(fu)(fu)銅(tong)(tong)(tong)(tong)(tong)板(ban)(ban)(ban)的(de)(de)(de)厚度(du)有1.0mm、1.5mm和2.0mm三(san)種。

該圖片由注冊用戶"壯志凌云"提供，版權聲明反饋

常用的覆銅板種類有哪些

覆銅板(ban)(ban)的種類也較(jiao)多。按(an)絕緣材料(liao)不同可分為(wei)紙基板(ban)(ban)、玻璃布(bu)基板(ban)(ban)和(he)合成纖維板(ban)(ban)；按(an)粘結(jie)劑樹脂不同又分為(wei)酚醛、環氧、聚(ju)脂和(he)聚(ju)四(si)氟乙烯等(deng)；按(an)用(yong)途可分為(wei)通用(yong)型和(he)特殊(shu)型。

（1）覆銅箔酚(fen)醛紙層壓板

是由絕緣浸(jin)(jin)漬紙（TFz一62）或棉纖維浸(jin)(jin)漬紙（1TZ-一63）浸(jin)(jin)以(yi)酚醛樹脂經(jing)熱壓而成的層壓制品，兩表面(mian)膠(jiao)(jiao)紙可附(fu)以(yi)單張無堿玻璃浸(jin)(jin)膠(jiao)(jiao)布，其一面(mian)敷以(yi)銅箔(bo)。主要(yao)用(yong)作無線電(dian)設備(bei)中的印制電(dian)路板。

（2）覆銅箔(bo)酚醛玻璃布(bu)層壓板

是用無堿玻璃布浸以環氧酚醛樹脂經熱壓而成的層壓制品，其一面或雙面敷以銅箔，具有質輕、電氣和機械性能良好、加工方便等優點。其板面呈淡黃色，若用三氰二胺作固化劑，則板面呈淡綠色，具有良好的透明度。主要在工作溫度和工作頻率較高的無線電設備中用作印制電路板。

（3）覆(fu)銅箔(bo)聚(ju)四(si)氟乙烯層壓板

是以聚四(si)氟乙烯板(ban)(ban)(ban)為基板(ban)(ban)(ban)，敷(fu)以銅(tong)箔(bo)經熱壓而成(cheng)的(de)一種敷(fu)銅(tong)板(ban)(ban)(ban)。主要用于高(gao)頻(pin)和(he)超高(gao)頻(pin)線路中作印制板(ban)(ban)(ban)用。

（4）覆銅箔環(huan)氧玻璃布層壓板(ban)

是孔金屬化印制(zhi)板常用(yong)的(de)材料。

（5）軟性聚酯敷(fu)銅(tong)薄膜

是用(yong)聚酯薄膜與銅(tong)熱壓而成的帶狀(zhuang)材(cai)料，在應用(yong)中將它(ta)(ta)卷曲成螺旋形(xing)狀(zhuang)放(fang)在設備內部。為了加固(gu)或防潮，常以(yi)環(huan)氧(yang)樹脂將它(ta)(ta)灌注成一(yi)個整(zheng)體(ti)。主(zhu)要用(yong)作柔性印制電路和印制電纜，可(ke)作為接插件的過渡線(xian)。目前，市場上供應的覆銅(tong)板(ban)(ban)，從基(ji)材(cai)考慮，主(zhu)要可(ke)分以(yi)下(xia)幾類：紙基(ji)板(ban)(ban)、玻(bo)纖(xian)布(bu)基(ji)板(ban)(ban)、合成纖(xian)維布(bu)基(ji)板(ban)(ban)、無紡布(bu)基(ji)板(ban)(ban)、復合基(ji)板(ban)(ban)。

覆銅板常用制作材料有哪些

FR-1──酚醛棉(mian)紙，這基材(cai)通稱電木(mu)板（比(bi)FR-2較高經濟性）

FR-2──酚醛(quan)棉紙

FR-3──棉紙（Cotton paper）、環氧(yang)樹(shu)脂(zhi)

FR-4──玻璃布（Woven glass）、環(huan)氧(yang)樹脂

FR-5──玻璃(li)布(bu)、環氧(yang)樹脂

FR-6──毛面玻璃、聚(ju)酯

G-10──玻璃布、環氧樹脂

CEM-1──棉紙(zhi)、環氧樹(shu)脂（阻(zu)燃(ran)）

CEM-2──棉紙、環(huan)氧樹脂（非阻燃）

CEM-3──玻璃布、環氧樹脂

CEM-4──玻璃布、環氧樹脂

CEM-5──玻璃布、多元酯

AIN──氮化鋁

SIC──碳化(hua)硅(gui)