一、半導體設備的基本原理和工作方式

半(ban)導(dao)體(ti)(ti)設備工作(zuo)原(yuan)理基于(yu)能(neng)帶(dai)(dai)(dai)理論(lun)，即在(zai)半(ban)導(dao)體(ti)(ti)中(zhong)存(cun)在(zai)價(jia)帶(dai)(dai)(dai)和導(dao)帶(dai)(dai)(dai)，其中(zhong)價(jia)帶(dai)(dai)(dai)是半(ban)導(dao)體(ti)(ti)材料中(zhong)的(de)(de)原(yuan)子(zi)，而(er)導(dao)帶(dai)(dai)(dai)中(zhong)的(de)(de)原(yuan)子(zi)在(zai)半(ban)導(dao)體(ti)(ti)中(zhong)被(bei)加熱或激發(fa)后被(bei)激發(fa)到價(jia)帶(dai)(dai)(dai)之(zhi)外。當(dang)外部(bu)電荷作(zuo)用于(yu)半(ban)導(dao)體(ti)(ti)中(zhong)時(shi)，它可以改變電子(zi)在(zai)能(neng)帶(dai)(dai)(dai)中(zhong)的(de)(de)分布，導(dao)致(zhi)電導(dao)率的(de)(de)變化(hua)。

半導體設備具有重(zhong)要的電子功(gong)能，如場效應(ying)管(guan)(guan)、整(zheng)流器、功(gong)率放大(da)器和(he)發光(guang)二極管(guan)(guan)。基于不同應(ying)用需(xu)要，半導體(ti)設(she)備可以通過材料、結構(gou)、工(gong)藝等方面做出不同的改進和(he)針對(dui)性設(she)計。

二、半導體設備核心部件是什么

據統(tong)(tong)(tong)(tong)(tong)(tong)計，半導(dao)體設(she)備的關(guan)鍵(jian)子系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)主要(yao)分為 8 大(da)類。包含：氣(qi)液流量控 制系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)、真空(kong)系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)、制程診斷系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)、光學系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)、電(dian)源及(ji)氣(qi)體反應系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)、熱(re)管理系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)、晶圓傳送系(xi) 統(tong)(tong)(tong)(tong)(tong)(tong)、其他集成(cheng)系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)及(ji)關(guan)鍵(jian)組件，每個子系(xi)統(tong)(tong)(tong)(tong)(tong)(tong)亦由數(shu)量龐大(da)的零部件組合而(er)成(cheng)。

不同(tong)半導(dao)體設備(bei)的(de)核(he)(he)心零(ling)部件有(you)所不同(tong)。例如：光刻機(ji)的(de)核(he)(he)心零(ling)部件包(bao)括(kuo)工作臺、投影物(wu)鏡、光源 等，而(er)等離子體真(zhen)空(kong)設備(bei)（PVD、CVD、刻蝕）的(de)核(he)(he)心零(ling)部件包(bao)括(kuo) MFC、射頻電源、真(zhen)空(kong)泵(beng)、ESC 等。