一、半導體設備的基本原理和工作方式

半(ban)導(dao)(dao)(dao)體設(she)備工作原理(li)基于能(neng)(neng)帶(dai)理(li)論(lun)，即在半(ban)導(dao)(dao)(dao)體中(zhong)(zhong)(zhong)存在價帶(dai)和(he)導(dao)(dao)(dao)帶(dai)，其中(zhong)(zhong)(zhong)價帶(dai)是半(ban)導(dao)(dao)(dao)體材料(liao)中(zhong)(zhong)(zhong)的原子，而導(dao)(dao)(dao)帶(dai)中(zhong)(zhong)(zhong)的原子在半(ban)導(dao)(dao)(dao)體中(zhong)(zhong)(zhong)被(bei)加熱或激(ji)發后(hou)被(bei)激(ji)發到價帶(dai)之(zhi)外(wai)(wai)。當外(wai)(wai)部電(dian)(dian)荷(he)作用于半(ban)導(dao)(dao)(dao)體中(zhong)(zhong)(zhong)時(shi)，它可以改變電(dian)(dian)子在能(neng)(neng)帶(dai)中(zhong)(zhong)(zhong)的分布，導(dao)(dao)(dao)致(zhi)電(dian)(dian)導(dao)(dao)(dao)率的變化。

半導體設備具有重要的電(dian)子功(gong)能，如場(chang)效(xiao)應管、整流器、功(gong)率放大器和發光二極管。基于不同應用(yong)需要，半導體設備可以通(tong)過材料、結(jie)構、工(gong)藝等(deng)方面做出不同的改進和針對性設計。

二、半導體設備核心部件是什么

據統(tong)(tong)(tong)(tong)計，半(ban)導體設備的關鍵(jian)子系(xi)統(tong)(tong)(tong)(tong)主(zhu)要分為 8 大類。包含(han)：氣液流(liu)量控(kong) 制系(xi)統(tong)(tong)(tong)(tong)、真空系(xi)統(tong)(tong)(tong)(tong)、制程診斷(duan)系(xi)統(tong)(tong)(tong)(tong)、光學系(xi)統(tong)(tong)(tong)(tong)、電源及(ji)氣體反應系(xi)統(tong)(tong)(tong)(tong)、熱管理系(xi)統(tong)(tong)(tong)(tong)、晶圓傳送系(xi) 統(tong)(tong)(tong)(tong)、其他集成(cheng)系(xi)統(tong)(tong)(tong)(tong)及(ji)關鍵(jian)組(zu)件(jian)(jian)，每個子系(xi)統(tong)(tong)(tong)(tong)亦由數量龐大的零部件(jian)(jian)組(zu)合(he)而(er)成(cheng)。

不(bu)同半導(dao)體設備的(de)(de)核(he)心(xin)零部(bu)(bu)件(jian)有所不(bu)同。例如(ru)：光刻機的(de)(de)核(he)心(xin)零部(bu)(bu)件(jian)包括工作臺、投影物鏡、光源(yuan) 等(deng)，而(er)等(deng)離子體真空設備（PVD、CVD、刻蝕(shi)）的(de)(de)核(he)心(xin)零部(bu)(bu)件(jian)包括 MFC、射頻電源(yuan)、真空泵、ESC 等(deng)。