一、覆銅板是什么東西什么材料
覆銅板是將電子玻纖(xian)布或其它增(zeng)強材(cai)料(liao)浸以(yi)樹脂，一面(mian)或雙面(mian)覆(fu)(fu)(fu)以(yi)銅(tong)(tong)(tong)箔并經熱壓而(er)制成(cheng)的(de)一種板(ban)(ban)狀材(cai)料(liao)，被(bei)稱為覆(fu)(fu)(fu)銅(tong)(tong)(tong)箔層壓板(ban)(ban)（Copper Clad Laminate，CCL），簡稱為覆(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)。各種不(bu)同(tong)形(xing)式、不(bu)同(tong)功能的(de)印制電路(lu)板(ban)(ban)，都是在覆(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)上(shang)有選(xuan)擇地進行加工、蝕刻、鉆孔及鍍銅(tong)(tong)(tong)等工序，制成(cheng)不(bu)同(tong)的(de)印制電路(lu)。
覆銅(tong)板(ban)作為印制電路板(ban)制造(zao)中(zhong)的(de)基板(ban)材(cai)料，對印制電路板(ban)主(zhu)要起互連導(dao)通、絕緣和支撐的(de)作用，對電路中(zhong)信號的(de)傳輸速度、能(neng)量(liang)損失和特(te)性阻抗等有很大的(de)影響，因此，印制電路板(ban)的(de)性能(neng)、品質、制造(zao)中(zhong)的(de)加工性、制造(zao)水平(ping)、制造(zao)成本(ben)以及長期(qi)的(de)可靠性及穩定性在很大程度上取(qu)決于(yu)覆銅(tong)板(ban)。
二、覆銅板和pcb板的區別
PCB也就是印制電路板，別(bie)稱(cheng)印刷線路板，PCB是電(dian)(dian)(dian)子元(yuan)器件(jian)(jian)的支(zhi)撐體，同時PCB也(ye)是電(dian)(dian)(dian)子元(yuan)器件(jian)(jian)電(dian)(dian)(dian)氣連(lian)接的載體。PCB能(neng)夠(gou)提供各元(yuan)器件(jian)(jian)固定裝配械支(zhi)撐，實現電(dian)(dian)(dian)子元(yuan)器件(jian)(jian)之(zhi)間(jian)的布(bu)線、電(dian)(dian)(dian)氣連(lian)接和電(dian)(dian)(dian)絕緣(yuan)。
覆銅(tong)板(ban)(ban)(ban)全名覆銅(tong)箔層壓(ya)板(ban)(ban)(ban)，簡稱(cheng)為CCL。覆銅(tong)板(ban)(ban)(ban)是在(zai)印制電(dian)路板(ban)(ban)(ban)制造中(zhong)的(de)(de)基(ji)板(ban)(ban)(ban)材(cai)料，PCB的(de)(de)各(ge)項(xiang)性能在(zai)很(hen)大程度上取(qu)決(jue)于覆銅(tong)板(ban)(ban)(ban)。
PCB并不是覆銅板。覆銅板是在(zai)膠質板(ban)的一面(mian)或者雙面(mian)覆(fu)有銅箔的板(ban)材(cai)，覆(fu)銅板(ban)是制作單面(mian)或者雙面(mian)PCB的材(cai)料。PCB是將電(dian)路的布(bu)局布(bu)線圖印制在(zai)覆(fu)銅板(ban)上，然后經(jing)過各種工(gong)藝后的電(dian)路板(ban)。
值得一提的(de)是，PCB除(chu)了單面(mian)和雙面(mian)之外，還(huan)有4層(ceng)、6層(ceng)、8層(ceng)、10層(ceng)的(de)。
